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10.0 W/m-K BERGQUIST^® LIQUI FORM Gel Tackles Heat Management Challenges in High Bandwidth Systems

Irvine, CA – Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST^® LIQUI FORM TLF 10000.  The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.  

Larger, higher-power devices such as ASICs and FPGAs are the norm in 5G telecom infrastructure gear, data center switches, routers and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and ...

Dual Cure, Active Alignment Optical Adhesive Delivers High Precision Performance for Optimal Transceiver Signal Integrity

Novel Thermal Management Coatings Aid in Reducing Operational Heat in Cloud and Hyperscale Data Center Optical Transceivers

Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.  While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal. 
 
Henkel has developed new micro-thermal interface coatings, the BERGQUIST^® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST^® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to...