High-Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-Level Exposed Pad Performance This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2. Read More
High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements Henkel’s latest innovation overcomes performance and processability challenges of traditional materials. Read More
