High-Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-Level Exposed Pad Performance This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2. Read More
Simplified New Approaches to High Thermal Die Attach Webinar Industry experts Jan Vardaman of TechSearch International and Davy Nakada of Henkel Corporation discuss the market conditions driving a new approach to high thermal conductive die attach materials and processes. Read More