LOCTITE® ABLESTIK QMI529HT
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This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
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Technische informatie
| Aanbevolen voor gebruik met | Bedradingsframe: Goud, Bedradingsframe: Zilver |
| Aantal componenten | 1-component |
| Afschuifsterkte RT-matrijs, 7.62 x 7.62 mm die on Ag/Cu leadframe | 57.0 kg-f |
| Afschuifsterkte bij hete matrijs, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe | 21.0 kg-f |
| Belangrijkste eigenschappen | Geleidbaarheid: Elektrisch geleidend, Geleidbaarheid: Warmtegeleidend |
| Coëfficiënt van thermische uitzetting (CTE) | 53.0 ppm/°C |
| Extraheerbare ionische inhoud, Chloride (CI-) | 20.0 ppm |
| Extraheerbare ionische inhoud, Fluoride (F-) | 20.0 ppm |
| Extraheerbare ionische inhoud, Kalium (K+) | 20.0 ppm |
| Extraheerbare ionische inhoud, Natrium (Na+) | 20.0 ppm |
| Fysieke vorm | Pasta |
| Thixotrope index | 4.8 |
| Toepassingen | Matrijsmontage |
| Trekmodulus, @ 25.0 °C | 3300.0 N/mm² (478500.0 psi ) |
| Uithardingstype | Uitharding door warmte |
LOCTITE® ABLESTIK QMI529HT
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.