LOCTITE® ABLESTIK QMI529HT
Omadused ja eelised
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. LOCTITE ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
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Tehniline teave
| Ekstraheeritav ioonisisu, Fluoriid (F-) | 20.0 ppm |
| Ekstraheeritav ioonisisu, Kaalium (K+) | 20.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 20.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 20.0 ppm |
| Füüsiline vorm | Pasta |
| Komponentide arv | 1-komponentne |
| Kuumlõike nihkejõud, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe | 21.0 kg-f |
| Peamised omadused | Juhtivus: Elektrit juhtiv, Juhtivus: Soojust juhtiv |
| RT kuumlõike nihkejõud, 7.62 x 7.62 mm die on Ag/Cu leadframe | 57.0 kg-f |
| Rakendused | Stantskinnitus |
| Soojuspaisumise koefitsient (CTE) | 53.0 ppm/°C |
| Soovitatav kasutada koos | Juhtmekorpus: hõbe, Juhtmekorpus: kuld |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 4.8 |
| Tõmbemoodul, @ 25.0 °C | 3300.0 N/mm² (478500.0 psi ) |
LOCTITE® ABLESTIK QMI529HT
This 1-part, BMI acrylate-based, conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.