BERGQUIST® GAP PAD TGP 1000VOUS

Features and Benefits

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
  • Highly conformable, low hardness
  • Thermal conductivity: 1.0 W/m-K
  • High dielectric strength
  • Decreased strain
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Technical Information

Carrier type Fiberglass
Color Pink
Operating temperature -60.0 - 200.0 °C
Standard thickness 0.508 - 6.35 mm
Thermal conductivity 1.0 W/mK
Young's modulus, ASTM D575 55.0 KPa (8.0 psi )