BERGQUIST® GAP PAD® TGP 1000VOUS
Poznat kao Gap Pad® VO Ultra Soft
Elementi i pogodnosti
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
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Dokumenti i preuzimanja
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Tehnički podaci
| Boja | Ružičasta |
| Jangov modul, ASTM D575 | 55.0 KPa (8.0 psi ) |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.508 - 6.35 mm |
| Tip nosača | Staklena vuna |
| Toplotna provodljivost | 1.0 W/mK |
BERGQUIST® GAP PAD® TGP 1000VOUS
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.