LOCTITE® ABLESTIK ABP 8910T
Şöyle bilinir ABLESTIK ABP-8910T
Özellikleri ve Faydaları
This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
For high MRT performance, high thermal conductivity, and high reliability, choose LOCTITE® ABLESTIK ABP 8910T. This heat cure, electrically non-conductive adhesive is ideal for use on medium to large die sizes, and is perfect for copper, silver, PPF and alloy 42 substrates.
Daha fazlasını okuyun
Dokümanlar ve İndirilebilir Belgeler
Başka bir dilde bir TDS veya SDS mi arıyorsunuz?
Teknik Bilgi
| Isıl genleşme katsayısı (CTE) | 28.0 ppm/°C |
| Kürlenme Türü | Isı Kürü |
| Uygulamalar | Çip Yapıştırma |
| Viskozite, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8910T
This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.