LOCTITE® ABLESTIK ABP 8910T

Known as ABLESTIK ABP-8910T

Features and Benefits

This electrically insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes. 
For high MRT performance, high thermal conductivity, and high reliability, choose LOCTITE® ABLESTIK ABP 8910T. This heat cure, electrically non-conductive adhesive is ideal for use on medium to large die sizes, and is perfect for copper, silver, PPF and alloy 42 substrates.  
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Technical Information

Applications Die Attach
Coefficient of thermal expansion (CTE) 28.0 ppm/°C
Cure type Heat Cure
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 13000.0 mPa·s (cP)