LOCTITE® ABLESTIK ABP 8910T
Known as ABLESTIK ABP-8910T
Features and Benefits
This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
For high MRT performance, high thermal conductivity, and high reliability, choose LOCTITE® ABLESTIK ABP 8910T. This heat cure, electrically non-conductive adhesive is ideal for use on medium to large die sizes, and is perfect for copper, silver, PPF and alloy 42 substrates.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 28.0 ppm/°C |
| Cure type | Heat cure |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8910T
This electrically-insulating die attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.