LOCTITE® ABLESTIK ABP 8068TB
Vlastnosti a výhody
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.
If you need a superior semi-sintering die attach adhesive for high end power packages, choose LOCTITE® ABLESTIK ABP 8068TB. It provides high adhesion, low stress, and enhanced resin bleed control. Thermal performance is comparable to that of a solder paste product, and you can expect great sintering properties on gold, silver, copper, and PPF substrates.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Koeficient tepelnej rozťažnosti (CTE) | 25.0 ppm/°C |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Tixotropný index | 5.5 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8068TB
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.