LOCTITE® ABLESTIK ABP 8068TB
Savybės ir privalumai
This rigid, semi-sintering die attach adhesive is ideal for semiconductor packages requiring excellent thermal and electrical conductivity.
If you need a superior semi-sintering die attach adhesive for high end power packages, choose LOCTITE® ABLESTIK ABP 8068TB. It provides high adhesion, low stress, and enhanced resin bleed control. Thermal performance is comparable to that of a solder paste product, and you can expect great sintering properties on gold, silver, copper, and PPF substrates.
Aprašymas
Dokumentai ir atsisiuntimai
Ieškote TDL arba SDL kita kalba?
Techniniai duomenys
Kietėjimo tipas | Kietėjimas veikiant šilumai |
Klampumas, „Brookfield“ CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
Tiksotropinis indeksas | 5.5 |
Šiluminio plėtimosi koeficientas (CTE) | 25.0 ppm/°C |