LOCTITE® ABLESTIK 2600BT

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LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach
LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver and resin particles suspended in solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600BT adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials.
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Tehnične informacije

Izvlečna ionska vsebina, Kalij (K+) 5.0 ppm
Izvlečna ionska vsebina, Klorid (CI-) 9.0 ppm
Izvlečna ionska vsebina, Natrij (Na+) 9.0 ppm
Koeficient toplotnega raztezanja (CTE) 40.0 ppm/°C
Način strjevanja Strjevanje na podlagi toplote
Primeri uporabe Pritrjevalniki
Strižna trdnost RT 10.0 kg-f
Strižna trdnost vročega vtiskovanja 1.4 kg-f