BERGQUIST® GAP PAD® TGP 1000VOUSB
Zināms kā Gap Pad® VO Ultra Soft-B
Iezīmes un ieguvumi
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps
BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
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Tehniskā informācija
Darbības temperatūra | -60.0 - 200.0 °C |
Junga modulis, ASTM D575 | 55.0 KPa (8.0 psi ) |
Krāsa | Melna |
Nesēja veids | Stikla šķiedra |
Siltumvadītspēja | 1.0 W/mK |
Standarta biezums | 0.508 - 3.175 mm |