BERGQUIST® GAP PAD® TGP 1000VOUSB

Known as Gap Pad® VO Ultra Soft-B

Features and Benefits

BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps
BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • Decreased strain
  • Puncture, shear and tear resistant
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Technical Information

Carrier type Fiberglass
Color Black
Operating temperature -60.0 - 200.0 °C
Standard thickness 0.508 - 3.175 mm
Thermal conductivity 1.0 W/mK
Young's modulus, ASTM D575 55.0 KPa (8.0 psi )