BERGQUIST® GAP PAD® TGP 1000VOUSB
Conhecido como Gap Pad® VO Ultra Soft-B
Características e Vantagens
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps
BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Ler mais
Documentos e Transferências
Procura uma FDT ou FDS noutro idioma?
Documentos Adicionais
Informação Técnica
| Condutividade térmica | 1.0 W/mK |
| Cor | Negro |
| Espessura padrão | 0.508 - 3.175 mm |
| Módulo de Young, ASTM D575 | 55.0 KPa (8.0 psi ) |
| Temperatura de operação | -60.0 - 200.0 °C |
| Tipo de operadora | Fibra de Vidro |
BERGQUIST® GAP PAD® TGP 1000VOUSB
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps