LOCTITE® ECCOBOND UF 3811

Caratteristiche e vantaggi

This halogen free, reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required. 
LOCTITE® ECCOBOND UF 3811 is a reworkable, low-viscosity epoxy underfill specially designed for CSP and BGA applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing. 
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Informazioni tecniche

Coefficiente di espansione termica (CTE), Above Tg 190.0 ppm/°C
Coefficiente di espansione termica (CTE), Below Tg 61.0 ppm/°C
Schema di polimerizzazione, @ 100.0 °C 60.0 min.
Temperatura di transizione vetrosa (Tg) 124.0 °C
Viscosità, Brookfield, Physica @ 25.0 °C Spindle CP50-1, Speed 20 rpm 354.0 mPa.s (cP)