LOCTITE® ECCOBOND UF 3811
Features and Benefits
This reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required.
LOCTITE® ECCOBOND UF 3811 is a halogen-free, reworkable, low-viscosity epoxy underfill specially designed for Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimise stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing.
- Room temperature flow
- Low viscosity
- High glass transition temperature (Tg)
- Fast cure at moderate temperatures
- No preheating required
Documents and Downloads
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 190.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 61.0 ppm/°C |
| Cure schedule, @ 100.0 °C | 60.0 min. |
| Glass transition temperature (Tg) | 124.0 °C |
| Viscosity, Brookfield, Physica @ 25.0 °C Spindle CP50-1, Speed 20 rpm | 354.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 3811
This reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required.