LOCTITE® ECCOBOND FP0087
Caratteristiche e vantaggi
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.
LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
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Informazioni tecniche
| Applicazioni | Incapsulamento |
| Coefficiente di espansione termica (CTE), Below Tg | 18.0 ppm/°C |
| Colore | Nero |
| Durezza shore, Shore D | 95.0 |
| Numero dei componenti | Monocomponente |
| Shelf life | 9.0 vero |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 20 rpm | 20000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP0087
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.