LOCTITE® ECCOBOND FP0087

Características e Benefícios

LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.
LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
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Informação Técnica

Aplicações Encapsulamento
Coeficiente de expansão térmica (CTE), Below Tg 18.0 ppm/°C
Cor Preto
Dureza shore, Shore D 95.0
Número de componentes Monocomponente
Tipo de cura Cura por Calor
Validade da folha 9.0 mês
Viscosidade, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 20 rpm 20000.0 mPa.s (cP)