LOCTITE® ECCOBOND FP0087

Features and Benefits

LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.
LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
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Technical Information

Applications Encapsulating
Coefficient of thermal expansion (CTE), Below Tg 18.0 ppm/°C
Colour Black
Cure type Heat cure
Number of components 1 part
Shelf life 9.0 mon.
Shore hardness, Shore D 95.0
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 20 rpm 20000.0 mPa·s (cP)