LOCTITE® ABLESTIK NCA 2380
Caratteristiche e vantaggi
This epoxy electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.
LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is perfect for use in the assembly of temperature sensitive electronic components. It has good flow performance, excellent adhesion, and is formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. This means you can make any necessary adjustments to the final device configuration before committing it to full cure.
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Informazioni tecniche
| Coefficiente di espansione termica (CTE) | 56.0 ppm/°C |
| Coefficiente di espansione termica (CTE), Above Tg | 183.0 ppm/°C |
| Indice tixotropico | 2.4 |
| Modulo di stoccaggio | 3.0 GPa |
| Temperatura di transizione vetrosa (Tg) | 95.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo e con UV |
| Viscosità, Shear Rate 10 s⁻¹ | 35000.0 mPa.s (cP) |
LOCTITE® ABLESTIK NCA 2380
This epoxy electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.