LOCTITE® ECCOBOND E 3230

Features and Benefits

LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant
LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.
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Technical Information

Casson viscosity, @ 25.0 °C Shear Rate 10 s⁻¹ 45200.0 mPa·s (cP)
Cure schedule, @ 100.0 °C 20.0 min.
Cure type Heat cure
Glass transition temperature (Tg) 58.0 °C
Storage temperature -20.0 °C
Thixotropic index 1.6