Whitepaper: Pushing Beyond the Status Quo New lead-free solder paste offers the ultimate in performance and versatility. Read More
Whitepaper: Lead-Free for High-reliability and High-Temperature Applications Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications. Read More
Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Read More
Solder Materials Science Gets Small Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Read More
Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling. Read More
Underfill Solutions for Industrial Applications Over the last years there was already an increased interest for underfill materials noticeable in the industrial markets due to the switch from Pb-containing to Pb-free solders. The relative brittleness of the Pb-free solder isn’t coping with the high mechanical forces (vibrations and shocks), humidity requirements and CTE mismatches induced by the harsh temperatures, resulting in solder fatigue. Besides this, applications coming from other markets are finding their way to the industrial areas like for instance the “infotainment” applications and surround view cameras in cars. These aren’t used to the harsher requirements resulting in unexpected failures. Using capillary underfill will help you to deal with the CTE mismatches, humidity and other contaminants to prevent these failures. This webinar will focus on the industrial market trends and requirements and how they relate to our product portfolio and research areas. Author: Stieven Josso Read More
Henkel to Debut New Materials, Share Expertise at IPC APEX Expo 2018 High-visibility masking material, low-voiding and jetting solder pastes on display. Read More
Henkel’s Novel Electrically Conductive Adhesive Technology Designed for Next-Generation Solar Device Assembly High Performance and Broad Effectiveness for Multiple PV Applications Read More