Whitepaper: Pushing Beyond the Status Quo New lead-free solder paste offers the ultimate in performance and versatility. Read More
Whitepaper: Lead-Free for High-reliability and High-Temperature Applications Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications. Read More
Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Read More
Solder Materials Science Gets Small Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Read More
Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling. Read More
Henkel to Debut New Materials, Share Expertise at IPC APEX Expo 2018 High-visibility masking material, low-voiding and jetting solder pastes on display. Read More
Henkel’s Novel Electrically Conductive Adhesive Technology Designed for Next-Generation Solar Device Assembly High Performance and Broad Effectiveness for Multiple PV Applications Read More
2018-05-24 Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices. Read More