Whitepaper: Pushing Beyond the Status Quo New lead-free solder paste offers the ultimate in performance and versatility. Read More
Solder Materials Science Gets Small Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Read More
Henkel to Debut New Materials, Share Expertise at IPC APEX Expo 2018 High-visibility masking material, low-voiding and jetting solder pastes on display. Read More
Henkel’s Novel Electrically Conductive Adhesive Technology Designed for Next-Generation Solar Device Assembly High Performance and Broad Effectiveness for Multiple PV Applications Read More
2018-05-24 Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices. Read More
Whitepaper: Epoxy Flux Technology Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps. Read More
Tombstoning Reduction via Phased-reflow Soldering Technical Article This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT). Read More
Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure. Read More
Henkel Develops Advanced Solder Paste Test Vehicle Novel test vehicle addresses miniaturization realities. Read More