Low Pressure Molding Solutions Many electronic assemblies are exposed to extreme conditions, such as strong temperature swings, corrosive environmental media or high humidity. Nevertheless, these devices have to deliver the expected performance, despite difficult environmental conditions. While Henkel has various solutions in its portfolio for electronic component and assembly protection, one in particular is a special hotmelt used in the low pressure molding process. These innovative hotmelts, which Henkel markets under the TECHNOMELT® brand, have a broad range of uses and are now available for almost every application. With the low pressure molding process, it is possible not only to bond surfaces but also to provide protective encapsulation, even for small and delicate electronic components. Thanks to the use of renewable raw materials, hotmelts are more environmentally compatible than other products and are RoHS and WEEE-approved materials. Once the hotmelts are in direct contact ... Read More
Whitepaper: Pushing Beyond the Status Quo New lead-free solder paste offers the ultimate in performance and versatility. Read More
Whitepaper: Lead-Free for High-reliability and High-Temperature Applications Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications. Read More
Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Read More
Solder Materials Science Gets Small Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Read More
Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling. Read More
PB-Free and Halogen-Free Solder for High Reliability Applications Webinar The RoHS directive has been well-publicized but often not fully understood. This webinar provides updates on the requirements of the legislation and how, in light of the move to lead-free, electronics assembly professionals can achieve high reliability. The webinar provides information on when to make the switch to Pb-free in the automotive and industrial markets, receive detailed reliability comparisons of SnPb versus Pb-free alloys, discussion of failure mechanisms and the limitations of SAC alloys, information on the distinction between a differentiation standard and high reliability and much, much more. Author: Ian Wilding Read More
Underfill Solutions for Industrial Applications Over the last years there was already an increased interest for underfill materials noticeable in the industrial markets due to the switch from Pb-containing to Pb-free solders. The relative brittleness of the Pb-free solder isn’t coping with the high mechanical forces (vibrations and shocks), humidity requirements and CTE mismatches induced by the harsh temperatures, resulting in solder fatigue. Besides this, applications coming from other markets are finding their way to the industrial areas like for instance the “infotainment” applications and surround view cameras in cars. These aren’t used to the harsher requirements resulting in unexpected failures. Using capillary underfill will help you to deal with the CTE mismatches, humidity and other contaminants to prevent these failures. This webinar will focus on the industrial market trends and requirements and how they relate to our product portfolio and research areas. Author: Stieven Josso Read More