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Wearing compounds are polymer composites that combines superior wear resistant given by abrasive ceramic fillers, with high adhesion provided by epoxy technology.

In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.