Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling. Read More
Whitepaper: Waterproof Sealant for Camera Modules Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices. Read More
Customizable Silicone Materials for Advanced MEMS Performance Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability. Read More
