Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling. Read More
Whitepaper: Waterproof Sealant for Camera Modules Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices. Read More
Whitepaper: Beyond Thermal Grease - Enhancing Thermal Performance and Reliability Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM). Read More
