In this video of our Henkel Lab Chats series, we discuss the BERGQUIST® GAP FILLER TGF 3010 APS and the BERGQUIST® GAP FILLER TGF 2200 APS. These Thermal Interface Materials (TIM) are uniquely designed for automotive power storage systems, which require not only reliable, but also fast dispensable solutions. Both materials offer a dispensing rate of more than 40 cc/sec, and a thermal conductivity of 3.0 and 2.2 W/mK respectively. Watch the video below to get an introduction from our expert to both materials. For further insights, our customer reference case on the BERGQUIST® GAP FILLER TGF 3010 APS is available here.
Hi, welcome to Henkel! I’m Chris and I want to show you how we’re using adhesive technologies to solve real-life engineering challenges. Follow me.
We’ve been asking our customers to share their design, performance and maintenance challenges with us. As the e-mobility market continues to expand, you’re asking more and more about improving battery efficiency and performance.
One common question you’ve asked is, “How can we better manage heat in EV battery packs?”. I’d like to answer this question by highlighting two key Henkel products.
First, let’s look at BERGQUIST GAP FILLER TGF 3010 APS. It’s a two-part gap filler that dispenses extremely fast and cures at room-temperature. It’s heavy-duty and engineered for components that demand high thermal conductivity. And then there’s BERGQUIST GAP FILLER TGF 2200 APS. It offers many of the same advantages as 3010, but with a relevant dispensing rate and lighter weight, making it a great option for components requiring standard-duty thermal conductivity.
These gap fillers are also “filling” an important role in Henkel’s adhesive portfolio – helping you beat the heat as battery temperatures rise. They’re specifically designed to reduce thermal resistance and runaway while also providing optimized dispensing control and low-stress application, giving you cost efficient, more optimized thermal control and long-term service of your battery systems.
What can Henkel solve next? Let us know in the comments!
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