LOCTITE® ABLESTIK 561K
功能與優點
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).
LOCTITE® ABLESTIK 561K is an electrically insulating, high strength, film adhesive specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficient of thermal expansion (CTE). Please note data and results will vary with different thicknesses.
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技術資訊
| 介電常數, @ 1kHz | 5.7 |
| 剪切強度, 鋁 | 3300.0 psi |
| 固化類型 | 熱固化 |
| 導熱性 | 0.9 W/mK |
| 建議固化方式, @ 150.0 °C | 30.0 分 |
| 物理形態 | 薄膜 |
| 玻璃化溫度(Tg) | 55.0 °C |
| 載體類型 | 玻璃纖維織物 |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).