LOCTITE® ABLESTIK 561K
Caractéristiques et avantages
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).
LOCTITE® ABLESTIK 561K is an electrically insulating, high strength, film adhesive specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficient of thermal expansion (CTE). Please note data and results will vary with different thicknesses.
En savoir plus
Documents et téléchargements
Vous cherchez une FDS ou une FT dans une autre langue ?
Informations techniques
| Conductivité thermique | 0.9 W/mK |
| Constante diélectrique, @ 1kHz | 5.7 |
| Forme physique | Film |
| Programme de durcissement, @ 150.0 °C | 30.0 min |
| Résistance au cisaillement, Aluminium | 3300.0 psi |
| Température de transition vitreuse | 55.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Type porteur | Tissu de verre |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).