LOCTITE® ABLESTIK 561K
Características y Ventajas
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).
LOCTITE® ABLESTIK 561K is an electrically insulating, high strength, film adhesive specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficient of thermal expansion (CTE). Please note data and results will vary with different thicknesses.
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Información técnica
| Conductividad térmica | 0.9 W/mK |
| Constante dieléctrica, @ 1kHz | 5.7 |
| Forma física | Película |
| Programa de curado, @ 150.0 °C | 30.0 min |
| Resistencia al corte, Aluminio | 3300.0 psi |
| Temperatura de transición vítrea (Tg) | 55.0 °C |
| Tipo de curado | Curado Térmico |
| Tipo de vehículo | Tejido de fibra de vidrio |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).