LOCTITE® ABLESTIK 561K
Features and Benefits
This adhesive film is designed for substrate-attach and heat-sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion (CTE).
LOCTITE® ABLESTIK 561K is an electrically insulating, high-strength, film adhesive specially designed for substrate-attach and heat-sink bonding – especially when materials are severely mismatched in terms of coefficient of thermal expansion (CTE). Please note data and results will vary with different thicknesses.
- Flexible for bonding mismatched adherents
- Reworkable
- Thermally conductive
- Electrically insulating film
- Manages applications where CTE mismatch is an issue
- High strength
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Technical Information
| Carrier type | Glass fabric |
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 5.7 |
| Glass transition temperature (Tg) | 55.0 °C |
| Physical form | Film |
| Shear strength, Aluminium | 3300.0 psi |
| Thermal conductivity | 0.9 W/mK |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate-attach and heat-sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion (CTE).