LOCTITE® ABLESTIK 561K
Características e Benefícios
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).
LOCTITE® ABLESTIK 561K is an electrically insulating, high strength, film adhesive specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficient of thermal expansion (CTE). Please note data and results will vary with different thicknesses.
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Informação Técnica
| Condutividade térmica | 0.9 W/mK |
| Constante dielétrica, @ 1kHz | 5.7 |
| Cronograma de cura, @ 150.0 °C | 30.0 min. |
| Forma física | Filme |
| Força de cisalhamento, Alumínio | 3300.0 psi |
| Temperatura de transição do vidro (Tg) | 55.0 °C |
| Tipo de cura | Cura por Calor |
| Tipo de operadora | Tecido de vidro |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).