LOCTITE® ABLESTIK 561K
Features and Benefits
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).
LOCTITE® ABLESTIK 561K is an electrically insulating, high strength, film adhesive specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficient of thermal expansion (CTE). Please note data and results will vary with different thicknesses.
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Technical Information
| Carrier type | Glass fabric |
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 5.7 |
| Glass transition temperature (Tg) | 55.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 3300.0 psi |
| Thermal conductivity | 0.9 W/mK |
LOCTITE® ABLESTIK 561K
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficient of thermal expansion (CTE).