LOCTITE® ABLESTIK 3290P

功能与优点

LOCTITE ABLESTIK 3290P, Epoxy, Die Attach
LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290 adhesive.
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技术信息

固化方式 热+紫外线
应用 芯片焊接
热膨胀系数 (CTE) 68.0 ppm/°C
热膨胀系数 (CTE), Above Tg 101.0 ppm/°C
玻璃化温度 (Tg) 136.0 °C
粘度,锥型和板型, @ 25.0 °C Speed 5 rpm 12000.0 mPa.s (cP)
触变指数 3.5