LOCTITE® ABLESTIK 3290P
Features and Benefits
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach
LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290 adhesive.
- Medium modulus
- Snap curable
- Low outgassing
- Conductive
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 68.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 101.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 136.0 °C |
| Thixotropic index | 3.5 |
| Viscosity, cone & plate, @ 25.0 °C Speed 5 rpm | 12000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 3290P
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach