LOCTITE® ABLESTIK ABP 8062T
Známe ako ABP-8062T (17.5g)
Vlastnosti a výhody
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. LOCTITE ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Koeficient tepelnej rozťažnosti (CTE) | 100.0 ppm/°C |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
LOCTITE® ABLESTIK ABP 8062T
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure