LOCTITE® ABLESTIK ABP 84-3JT

Features and Benefits

LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
LOCTITE® ABLESTIK ABP 84-3JT die attach adhesive is designed for high reliability packaging applications. It is formulated with a moderate modulus and high adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided. It contains 1 mil spacers for better bondline and stress control.
Read More

Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 36.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 117.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 56.0 °C
Thermal conductivity 0.6 W/mK
Thixotropic index 4.4
Viscosity, Brookfield, @ 25.0 °C Speed 5 rpm 10900.0 mPa·s (cP)