LOCTITE® ABLESTIK 84-3J
Features and Benefits
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach
LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 41.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 112.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 10.0 ppm |
| Extractable ionic content, Potassium (K+) | 20.0 ppm |
| Extractable ionic content, Sodium (Na+) | 5.0 ppm |
| Glass transition temperature (Tg) | 87.0 °C |
| RT die shear strength | 21.0 kg-f |
| Tensile modulus, @ 250.0 °C | 172.0 N/mm² (25000.0 psi ) |
| Thermal conductivity | 0.5 W/mK |
| Thixotropic index | 2.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 20000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 84-3J
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach