LOCTITE® ABLESTIK 84-3J

Features and Benefits

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LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach
LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.
  • Electrically Insulating
  • Engineered for accurate bondline control
  • One component
  • Long work life
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Documents and Downloads

Technical Data Sheet
LOCTITE® ABLESTIK 84-3J
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 41.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 112.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 10.0 ppm
Extractable ionic content, Potassium (K+) 20.0 ppm
Extractable ionic content, Sodium (Na+) 5.0 ppm
Glass transition temperature (Tg) 87.0 °C
RT die shear strength 21.0 kg-f
Tensile modulus, @ 250.0 °C 172.0 N/mm² (25000.0 psi )
Thermal conductivity 0.5 W/mK
Thixotropic index 2.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 20000.0 mPa·s (cP)