LOCTITE® ABLESTIK 84-3J
功能与优点
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach
LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.
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技术信息
| RT 模剪切强度 | 21.0 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 10.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 5.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 20.0 ppm |
| 固化方式 | 热固化 |
| 导热性 | 0.5 W/mK |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 172.0 N/mm² (25000.0 psi ) |
| 热膨胀系数 (CTE) | 41.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 112.0 ppm/°C |
| 玻璃化温度 (Tg) | 87.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 20000.0 mPa.s (cP) |
| 触变指数 | 2.5 |
LOCTITE® ABLESTIK 84-3J
LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach