LOCTITE® 3508NH
Merkmale und Vorteile
Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.
If you’re looking for a reliable underfill to protect electronic products from shock, drop, and vibration, consider LOCTITE® 3508NH. This black, 1-part epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components. Ultimately to improve the mechanical reliability of hand-held devices. LOCTITE 3508NH can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
Weiterlesen
Dokumente und Downloads
Suchen Sie nach einem TDS oder SDS in einer anderen Sprache?
Technische Informationen
| Glasübergangstemperatur (Tg) | 118.0 °C |
| Viskosität, Kegel-Platte-System, @ 25.0 °C | 70000.0 mPa.s (cP) |
| Wärmeausdehnungskoeffizient (CTE) | 65.0 ppm/°C |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 175.0 ppm/°C |
LOCTITE® 3508NH
Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.