LOCTITE® 3508NH
Features and Benefits
Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.
If you’re looking for a reliable underfill to protect electronic products from shock, drop, and vibration, consider LOCTITE® 3508NH. This black, 1-part epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components. Ultimately to improve the mechanical reliability of hand-held devices. LOCTITE 3508NH can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
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Technical Information
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 175.0 ppm/°C |
| Glass transition temperature (Tg) | 118.0 °C |
| Viscosity, cone & plate, @ 25.0 °C | 70000.0 mPa·s (cP) |
LOCTITE® 3508NH
Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.