BERGQUIST® TGF 3010APS
Features and Benefits
A highly thermally-conductive liquid gap filler for easy, fast dispensing and low stress assembly. Ideal for high throughput applications like automotive power storage systems in the automotive industry.
When you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress, BERGQUIST® GAP FILLER TGF 3010APS is an excellent fit. This specially-formulated silicone-free, 2-part gap filler offers a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and cures at room temperature. It is designed for silicone sensitive application to have low stress, avoiding damage during battery module assembly.
- Silicone-free
- Very high dispense rate
- Low compression force
- Room temperature cure
- High thermal conductivity of 3 W/mK
Documents and Downloads
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Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -40.0 - 80.0 °C |
| Thermal conductivity | 3.0 W/mK |
| Mixed | |
| Color, Mixed | Black |
| Resin | |
| Color, Resin | Black |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® TGF 3010APS
A highly thermally-conductive liquid gap filler for easy, fast dispensing and low stress assembly. Ideal for high throughput applications like automotive power storage systems in the automotive industry.