BERGQUIST® TGF 3010APS
Merkmale und Vorteile
A highly thermally-conductive liquid gap filler for easy, fast dispensing and low stress assembly. Ideal for high throughput applications like automotive power storage systems in the automotive industry.
When you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress, BERGQUIST® GAP FILLER TGF 3010APS is an excellent fit. This specially-formulated silicone-free, 2-part gap filler offers a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and cures at room temperature. It is designed for silicone sensitive application to have low stress, avoiding damage during battery module assembly.
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Technische Informationen
Aushärtetechnik | Aushärtung durch Wärme |
Betriebstemperatur | -40.0 - 80.0 °C |
Entflammbarkeit | V-0 |
Wärmeleitfähigkeit | 3.0 W/mK |
Harz | |
Farbe, Harz | Schwarz |
Härter | |
Farbe, Härter | Weiß |
Mischung | |
Farbe, Mischung | Schwarz |