BERGQUIST® TGF 3010APS

Merkmale und Vorteile

A highly thermally-conductive liquid gap filler for easy, fast dispensing and low stress assembly. Ideal for high throughput applications like automotive power storage systems in the automotive industry.
When you need a combination of excellent thermal conductivity, high dispense rate and low compressive stress, BERGQUIST® GAP FILLER TGF 3010APS is an excellent fit. This specially-formulated silicone-free, 2-part gap filler offers a dispense rate of up to 80 cc/sec, a 3.0 W/m-K thermal performance, and cures at room temperature. It is designed for silicone sensitive application to have low stress, avoiding damage during battery module assembly.
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Technische Informationen

Aushärtetechnik Aushärtung durch Wärme
Betriebstemperatur -40.0 - 80.0 °C
Entflammbarkeit V-0
Wärmeleitfähigkeit 3.0 W/mK
Harz
Farbe, Harz Schwarz
Härter
Farbe, Härter Weiß
Mischung
Farbe, Mischung Schwarz

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