LOCTITE® ABLESTIK 933-1
功能與優點
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant
LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
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技術資訊
| 儲存溫度 | -40.0 °C |
| 固化類型 | 熱固化 |
| 建議固化方式, @ 125.0 °C | 2.0 小時 |
| 應用 | 封裝 |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 5 rpm | 360500.0 mPa.s (cP) |
| 零組件數 | 1 組分 |
LOCTITE® ABLESTIK 933-1
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant