LOCTITE® ABLESTIK 933-1
Elementi i pogodnosti
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant
LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
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Dokumenti i preuzimanja
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Tehnički podaci
| Broj komponenti | 1 deo |
| Primene | Enkapsulacija |
| Raspored polimerizacije, @ 125.0 °C | 2.0 sat |
| Temperatura čuvanja | -40.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 360500.0 mPa.s (cP) |
LOCTITE® ABLESTIK 933-1
LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant